The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
Ball-Attach Flux Technical Documents
Product Data Sheets
Safety Data Sheets
Ball-Attach Blog Posts
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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