The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
Ball-Attach Flux Technical Documents
Product Data Sheets
Safety Data Sheets
Ball-Attach Blog Posts
If you haven’t heard about Bi-containing (bismuth) solder alloys recently, that may change in the near future. Low-melting Bi-containing solders are now in increasing use and gaining popularity due to their lower melting temperatures—58Bi/42Sn is eutectic at 138°C and 57Bi/42Sn/1Ag melts…
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment from the number of assembly processes needed before. These processes can be…
While not directly part of Indium Corporation’s Technical Service department, Maria is technology driven and works with our customers to help select the perfect products for their needs. In her role as Product Specialist for Semiconductor and Advanced Assembly Materials she tests all of our newest…
Andy C. Mackie, PhD, MSc
Senior Product Manager, Semiconductor Assembly Materials
From One Engineer to Another®
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