Ball-Attach Flux
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
Ball-Attach Flux Technical Documents
Whitepapers
Application Notes
Product Data Sheets
Material Safety Data Sheets
Ball-Attach Blog Posts
Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sze-Pei Lim appears here. This time, while on a visit to a logic device manufacturer in the North West, I [ACM] talked briefly to Sehar Samiappan [SS],…
2.5D Packaging vs 3D Packaging
7月份，我有幸去了景色迷人的三藩市(San Francisco)参加Semicon West展会，并听了“The 2.5 & 3 D packaging landscape for 2015 and beyond”的技术讲座。 这是我第一次参加半导体方面的展会，虽然2.5D 和3D packaging等相关词语听多了，但是真正含义是什么，也是直到最近才真正了解。…
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest to everyone who uses a dipping process in both SMT and flip-chip assembly. Firstly, a little background.…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
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