The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials.
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Ball-Attach Flux Technical Documents
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Ball-Attach Blog Posts
Currently, for the ball-attach process, customers are facing issues like warpage of the substrates...
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment...
While not directly part of Indium Corporation’s Technical Service department, Maria is technology driven and works with our customers to help select the perfect products for their needs. In her role as Product Specialist...
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
From One Engineer to Another®
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