Package-on-Package Flux
Package-on-Package (PoP) assembly is most commonly carried out by printing solder paste onto the substrate and placing the logic chip into the paste. The memory package is then either dipped into a specially-designed PoP flux or solder paste and placed on top of the logic chip. The whole assembly is then reflowed. No-clean processes are used.
Package-on-Package Blog Posts
Variables in the Package-on-Package Process
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While the chemistry of your PoP dipping flux or paste plays a major role in PoP assembly, there is also much to consider in terms of the components, equipment,…
2.5D Packaging vs 3D Packaging
7月份，我有幸去了景色迷人的三藩市(San Francisco)参加Semicon West展会，并听了“The 2.5 & 3 D packaging landscape for 2015 and beyond”的技术讲座。 这是我第一次参加半导体方面的展会，虽然2.5D 和3D packaging等相关词语听多了，但是真正含义是什么，也是直到最近才真正了解。…
3D Electronics
Browse the coming attractions at your local movie theater. How many 3D movies are being advertised? 3D is a very exciting technology for movie and TV watchers, and the future of it may be based in three other 3D technologies. Let's start with the initial building block of any electronic…
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