There are many factors that determine bump height. One key aspect of bump height is bump co-planarity or the uniformity of height from bump to bump across a wafer.ւ The most effective way to ensure each bump is of similar height is to control solder volume. Volume of solder can be controlled in the wafer printing process by choosing a high quality bumping paste and optimizing printer settings.
Bump Dimensions and Wafer Paste
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
