Product Specialist, High-Temperature Applications
Phone: +1 (315) 853-4900 x2148
Address: 34 Robinson Road, Clinton, NY 13323
Bernie is responsible for promoting and growing Indium Corporation’s product line for high-temperature applications. He works with the sales support team to identify current and potential customer accounts, participates in sales forecasting, and handles customer communications and product inquiries.
Bernard joined Indium Corporation in 2007. In 2010 he moved to sales as an Account Coordinator responsible for relationship management and assisting with inside sales.
Bernard attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College. He resides in Stratford, NY.
Bernard Leavitt's Technical Documents
Bernard Leavitt's Blog Posts
80Au20Sn solder paste and preforms both have particular attributes that make them ideal for certain bonding applications. We take a look at how your production furnace determines which form you use, and how material characteristics help aid in production.
Gold-based solder alloys have superior strength and conductivity; perfect for applications requiring a high temperature, reliable bond that can hold up to extreme environments.
Creating an airtight or hermetic seal is a critical-- and an especially challenging-- requirement for high-reliability packages. The 72Ag28Cu profile provided can give you a good reference point for evaluating your current manufacturing profiles. We understand that there are a number of variables that impact your production. Reevaluating your dwell and liquidus time in your profile can help improve the quality of your products.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.