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Bump Dimensions and Wafer Paste

Category:
  • Solderability
  • Solder Paste
  • Solder Bumping
  • Soldering
  • Solder
  • Indium Corporation

  • There are many factors that determine bump height.  One key aspect of bump height is bump co-planarity or the uniformity of height from bump to bump across a wafer.ւ The most effective way to ensure each bump is of similar height is to control solder volume. Volume of solder can be controlled in the wafer printing process by choosing a high quality bumping paste and optimizing printer settings.