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Eliminating the Bond Stress of Sputtering Targets at Operating Temperatures

For anyone who couldn’t make it to the 2013 SVC, just email me at jhisert@indium.com and I can make sure you receive a copy of “Eliminating the Bond Stress of Sputtering Targets at Operating Temperatures”. This paper discusses alternative processes for bonding targets - alternative processes that demonstrate the unique capabilities of NanoFoil® and open your mind to currently undiscovered methods.

Interested? Let me know!