One of the great reasons to use a localized heating method like NanoBonding is to make sure the entire assembly is not heated – only the bond area. This is important to control expansion of materials during bonding – especially if they have dissimilar coefficients of thermal expansion, or if some of the materials have a relatively low melting point. NanoFoil® has a heat of reaction of 1050 – 1250J/g depending on which thickness you are using. This translates to an estimated maximum reaction temperature of 1400 - 1600°C. As we will discuss in a separate post, this heat only travels a short distance through the materials.
*This post is part of the NanoBond® Process series