Indium Blog

Heat Dissipation During a NanoBond® Reaction

  • Die Attach
  • Indium Corporation
  • NanoBond®
  • NanoFoil®

  • One of the best parts of using NanoFoil® to create a bond with dissimilar metals or heat sensitive components is that the heat it creates is quickly dissipated before it can heat up areas outside of the bondline.

    In the pictures above (taken before, during, and after a NanoBond®), you can see that the crazy Application Engineer’s fingers are only millimeters away from the 1400C heat source – 3mm to be exact.  Yet he felt just a slight warmth. Although the fingertips can be sensitive, you may be more interested in heat sensitive components. Here is a link with a thermal model of a silicon die to heat spreader attachment.


    *This post is part of the NanoBond® Process series

    Authored by previous Indium Application Manager Jim Hisert