使用NanoFoil®与异种金属或热敏感元件进行粘接的一个优点是，它产生的热量在加热粘接线以外的区域之前就能迅速散去。
在上面的图片（NanoBond® 前、中、后拍摄）中，您可以看到这位疯狂的应用工程师的手指距离 1400C 的热源只有几毫米，确切地说只有 3 毫米。但他只感觉到轻微的温热。虽然指尖可能很敏感，但您可能对热敏元件更感兴趣。这里有一个硅芯片与散热器连接的热模型链接。
*本文章是NanoBond®工艺系列的一部分
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