使用NanoFoil®與異種金屬或熱敏元件進行接合的其中一個優點是，它所產生的熱能在加熱接合線以外的區域之前就能迅速散去。
在上面的圖片中（NanoBond® 前、中、後拍攝），您可以看到瘋狂的應用工程師的手指離 1400C 的熱源只有幾毫米的距離 - 準確地說是 3 毫米。然而，他只感受到輕微的溫度。雖然指尖可能很敏感，但您可能對熱敏元件更感興趣。這裡有一個矽晶片與散熱器連接的熱模組的連結。
*本文章為NanoBond®製程系列的一部分
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