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Test Methods for ECM Assessment & Process Control: Process Considerations for Flux Reliability

Brook Sandy-Smith and Phil Zarrow discuss leftover flux residue's contribution to electrochemical migration, using localized testing to help identify critical areas of assemblies, and how Indium8.9HF Solder Paste, a halogen-free, no-clean, lead-free flux, passed on all profiles—meaning that even with varying heating profiles, Indium8.9HF will maintain a benign residue.