Tin whiskers are very fine filaments or whiskers of tin that form out of the surface of the tin. See Figure 1. They are the result of stress release in the tin. Tin whiskers are a phenomenon that is surprising when first encountered, as their formation just doesn’t seem intuitive.
Figure 1. Note how thin a tin whisker can be compared to a human hair. The image is from the NASA Tin Whisker Website
They are a concern, as they can cause electrical short circuits or intermittent short circuits as a fusible link. Lead in tin-lead solder greatly suppresses tin whisker growth. Therefore, with the advent of lead-free solders there is a justifiable concern for decreasing reliability due to tin whisker growth in electronics.
Tin whiskers can vary in length and width, as is seen in Figure 2. Note that although only about 10% are as long a 1000 microns (1 mm). That length and occurrence rate is such as to cause many reliability concerns.
Figure 2. The length and width of some tin whiskers. The source is also the NASA Tin Whisker Website.
Over the following weeks I plan to post how tin whiskers form and strategies to alleviate them. Most of the information I will post comes from a paper I presented with Annaka Balch at the SMTA PanPac 2019.
NASA has an excellent website that provides much information about tin whiskers and is a source for historic critical failures caused by tin whiskers.