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Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms

Category:
  • Avoid the Void
  • Videos
  • Solder Preforms
  • Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the challenge of voiding in bottom-terminated components and how to Avoid the Void™.

     

    Keywords: voiding, Avoid the Void, Indium Corporation, indium, Solder Fortification, preforms, bottom terminated components, solder, flux, reflow, solder paste, QFN component, voids, Tim Jensen, tjensen@indium.com, indium.com