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Southeast Asia Technical Conference on Electronics Assembly Presentation

Category:
  • SAC305
  • Indium Corporation
  • I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACm®.

    My presentation examines the reliability of low-Ag SAC alloys doped with Mn (SACm®) under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.

     

    For more information, or to register, visit http://www.smta.org/education/symposia/symposia.cfm#penang

    Tim