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Thermal Cycling Performance of SACm® Pb-Free Solder Alloy

The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock performance of low-Ag SAC (SnAgCu) alloys. We learned that the addition of Mn to create SACm® also helps to improve the thermal cycling performance through refining the grain structure and slowing the intermetallic growth during aging.

The thermal cycling performance of SACm® is superior to SAC305 after aging (see graph). 

To learn all of the performance attributes of SACm®, visit


*This post is part of the Introducing SACm® series.