If you have been hoping that you current BGA process doesn’t fall victim to non-wets, it’s time to gain confidence. It sounds like you need a ball attach flux that is powerful. Those old solderability tests that define a flux’s wetting characteristics are done on clean copper. If you’re like the rest of the industry, I doubt you are using bare copper pads on your substrates. We know what works with different alloys on many various surfaces including Au/Sn, OSP, and Nickel (to name a few). Stop worrying about the flux you are using and give me a call @ (315) 853-4900 x7592.
Ball Attach Flux for a High Yield Process
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
