Pré-formas de liga de ouro
AuLTRA® 75/78/79 Off-Eutectic Preforms
The solidus and liquidus of off-eutectic alloys differ, creating a molten range where the allow appears plastic or pasty. As gallium nitride (GaN) dies gain popularity in high-frequency, high-power, and high-reliability RF power amplifiers for 5G, as well as crucial military and aerospace wireless communications, soldering these dies presents significant challenges.
GaN dies have thick gold plating—10 times thicker than is standard—to prevent oxidation, which can alter the final joint composition post-reflow, deviating from the desired 80Au20Sn composition. Maintaining the eutectic composition of 80Au20Sn in the solder joint is crucial for leveraging the unique properties of the alloy, particularly its high joint strength. Lowering the gold content in the alloy allows the solder to absorb some of the gold from the plating, resulting in a final strong joint composition of the eutectic 80Au20Sn.
Desenvolvido por Indium Corporation
- Strong Solder Joints in Die-Attach Applications
- Superior Wetting and Voiding
- Adjustment of the Final Solder Joint Composition
Visão geral do produto
Ligas disponíveis
- 79Au21Sn
- 78Au22Sn
- 75Au25Sn
Geometria
Guidelines for preform geometry can be derived from the die size. Generally, 90-100% of the die size indicates the preform’s x and y dimensions. Our AuLTRA® 75 off-eutectic AuSn alloys have thickness capabilities down to 0.005″. As for thickness, our Off-Eutectic AuSn alloys have thickness capabilities down to 0.0005″. The most critical attribute for a die bonding application is flatness. Due to process constraints, fixturing can be challenging and time consuming. Allowing the die to float freely on the preform can be advantageous. If the preform is not flat, it can skew the die during reflow and lead to failure. Proper processing is key to preserving flatness.
Alloy Chemistry
AuSn has a sensitive eutectic phase, which can be altered by Au-rich metallizations. This can result in areas that do not wet or flow properly, creating a weak solder joint. Adjustments with off-eutectic AuSn alloy compositions can be made to accommodate these metallizations, resulting in joint characteristics that are optimized for high reliability and performance.
Embalagem
Packaging in waffle trays is the primary method for many die-attach applications while tape & reel is another similar technique that can be used. Both methods are suitable for automated assembly and offer excellent protection during transit and storage. Die-attach preforms can come in various sizes, so flexibility in design is important. We have an extensive library of trays and tape available.
AuLTRA® Off-Eutectic Preforms
See our available alloy compositions below:
| Liga metálica | Temperature (Solidus) | Temperature (Liquidus) |
|---|---|---|
| Au75Sn25 – Indalloy®270 | 278°C | 332°C |
| Au78Sn22 – Indalloy®269 | 278°C | 301°C |
| Au79Sn21 – Indalloy®271 | 278°C | 289°C |
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AuLTRA® 75 off-eutectic preforms are suitable for a variety of applications.
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Indium Corporation is a leading gold solder innovator for high-temperature, high-reliability, and critical applications such as die-attach and hermetic sealing in the following industries and markets:
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