Gestão térmica
TIM1, TIM1.5 e TIM2
Metal-based thermal interface material (TIM) solutions provide superior thermal performance and long-term reliability across multiple layers of the thermal stack. Whether using air cooling, direct liquid cooling, or immersion cooling, these TIMs can be tailored to meet specific thermal demands. Their ability to wet to a wide range of surfaces, combined with high isotropic thermal conductivity and low yield and flow strengths, allows them to conform to surface irregularities, effectively reducing overall thermal resistance (Rth).
Visão geral
Especializada em TIMs à base de metal com vantagens térmicas, de fiabilidade e de conformidade
Indium Corporation leads the way in developing novel TIMs and processes for TIM1, TIM1.5, and TIM2 applications.
TIM1
Solders and liquid metals are used as high-performance TIMs between a semiconductor die and a package lid. Reflow and non-reflow solutions are available for LGA, PGA and BGA packages that see single or multiple reflow cycles.
TIM1.5
High-performance computing (HPC) applications require best-in-class TIM materials and process expertise. TIM1.5 (bare die lidless BGA packages) is the interface between a bare die and a heat-sink or cold plate and is often used in HPC design. Indium Corporation can help you choose between soldered, compressible, or liquid metal-based TIMs.
TIM2
TIM2 is the interface between a heat spreader or lid and a heat-sink. We typically recommend compressible TIMs, such as Heat-Spring®.
TIM1, TIM1.5, & TIM2 Products
Solda TIMs
Solder TIM solutions offer superior reliability and…
TIMs compressíveis
Compressible TIMs for top thermal performance and…
Metal líquido e pasta de metal líquido
Liquid metals that are RoHS-compliant and non-toxic.
TIMs metálicos de mudança de fase
Discover the advantages of PCMA TIMs over…
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