Thermal Interface Materials
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NanoFoil® for CPV Attachment
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…
Coefficient of Thermal Expansion
When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface, whether you are choosing materials that will expand and contract at the same rate or bonding alloys or processes that will handle the stress of…
Thermal conductivity of NanoFoil®
A NanoBond® acts like a traditional solder bond in many ways. After reaction, the bulk properties of NanoFoil® are similar to that of many solders. To me, the property that is most attractive (since it is similar to that of a solder) is the thermal conductivity of reacted NanoFoil®. Just…
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Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com
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