TIM1, TIM1.5, TIM2
Indium Corporation has products for TIM1, TIM1.5, and TIM2 applications.
Solder preforms can be used between a processor die and a heat-spreader as a solder thermal interface material. This application is often referred to as TIM1 or first level TIM.
Heat-Springs® and liquid metal can be used between a heat-spreader and a heat-sink as a compressible interface material. This is often referred to as TIM2, or second level TIM.
In mobile applications or bare die applications, such as laptops or video graphics boards, there is no heat-spreader, and the die is in direct contact with a cooling solution. This is referred to as TIM1.5. In this application, compressible materials, such as Heat-Springs® or liquid metal, are used.
TIM1, TIM1.5, TIM2 Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Thermal Interface Material Blog Posts
Watch as I discuss voiding in thermal management and how you can Avoid the Void.™
Find out why indium metal is the optimum choice for high-end electronics thermal management, even though some metals have higher thermal conductivity values.
High performance thermal management requires high performance materials. In this case, Heat-Spring®
Product Manager for Engineered Solders Materials
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.