TIM1, TIM1.5, TIM2
Indium Corporation has products for TIM1, TIM1.5, and TIM2 applications.
Solder preforms can be used between a processor die and a heat-spreader as a solder thermal interface material. This application is often referred to as TIM1 or first level TIM.
Heat-Springs® and liquid metal can be used between a heat-spreader and a heat-sink as a compressible interface material. This is often referred to as TIM2, or second level TIM.
In mobile applications or bare die applications, such as laptops or video graphics boards, there is no heat-spreader, and the die is in direct contact with a cooling solution. This is referred to as TIM1.5. In this application, compressible materials, such as Heat-Springs® or liquid metal, are used.
TIM1, TIM1.5, TIM2 Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Thermal Interface Material Blog Posts
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical tracks: Interposers & 2.5/3D Packaging Modeling,…
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When dealing with bonding, we often mention CTE (Coefficient of Thermal Expansion). This is a very important topic when designing a soldered interface, whether you are choosing materials that will expand and contract at the same rate or bonding alloys or processes that will handle the stress of…
Senior Product Manager, Engineered Solders
From One Engineer to Another®
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