TIM1, TIM1.5, TIM2
Indium Corporation has products for TIM1, TIM1.5, and TIM2 applications.
Solder preforms can be used between a processor die and a heat-spreader as a solder thermal interface material. This application is often referred to as TIM1 or first level TIM.
Heat-Springs® and liquid metal can be used between a heat-spreader and a heat-sink as a compressible interface material. This is often referred to as TIM2, or second level TIM.
In mobile applications or bare die applications, such as laptops or video graphics boards, there is no heat-spreader, and the die is in direct contact with a cooling solution. This is referred to as TIM1.5. In this application, compressible materials, such as Heat-Springs® or liquid metal, are used.
TIM1, TIM1.5, TIM2 Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Thermal Interface Material Blog Posts
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components. Four common uses for solder alloys that are not soldering applications are: Fusible plugs or links (these…
Today’s technology simplifies the translation of an idea into a design. A drawing can be dimensioned in an instant. Thermal models and strength of materials calculations predict the reliability of a solder joint before a single part is made. However, before we get to that point we must…
The 46th International Symposium on Microelectronics will be held in Orlando, Florida, September 30th through October 3rd, 2013. I will be attending both as as an exhibitor and as a session co-chair. TECHNICAL SESSION: This year there will be 6 technical tracks: Interposers & 2.5/3D Packaging Modeling,…
Senior Product Manager, Engineered Solders
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.