TIM1, TIM1.5, TIM2
Indium Corporation has products for TIM1, TIM1.5, and TIM2 applications.
Solder preforms can be used between a processor die and a heat-spreader as a solder thermal interface material. This application is often referred to as TIM1 or first level TIM.
Heat-Springs® and liquid metal can be used between a heat-spreader and a heat-sink as a compressible interface material. This is often referred to as TIM2, or second level TIM.
In mobile applications or bare die applications, such as laptops or video graphics boards, there is no heat-spreader, and the die is in direct contact with a cooling solution. This is referred to as TIM1.5. In this application, compressible materials, such as Heat-Springs® or liquid metal, are used.
TIM1, TIM1.5, TIM2 Technical Documents
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Product Data Sheets
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Safety Data Sheets
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Thermal Interface Material Blog Posts
High performance thermal management requires high performance materials. In this case, Heat-Spring®
Recently I heard about two of my friends (and co-workers) taking on an additional responsibility in the electronics industry. Tim Jensen (Senior Product Manager for Engineered Solder Materials) and Maria...
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components. Four common uses for solder alloys that are not soldering img alt="" src="//cdn.app.compendium.com/uploads/user/af12973f-cd7e-4c45-9491-c37a7fb2af13/f257d3c4-c185-4407-a4e9-16920aaabcb7/Image/bf50026d4bc018ebe1a3e0fd0cbe825e/thermal_interface_indium_metal_compressible_w1024.jpeg" style="border-width: 5px; border-style: solid; margin-left: 10px; margin-right: 10px;...
Senior Product Manager,
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.