Indium Corporation - Mailchimp

Avoid the Void™ Using Heat-Spring Metal Thermal Interface Materials

Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal management and how you can Avoid the Void™.


Keywords: voiding, void, Avoid the Void, Heat-Spring, thermal interface materials, thermal management, conductivity, performance, grease, thermal cycling, CTE mismatch, voids, indium, Indium Corporation, Tim Jensen,,