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Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials

  • Thermal Interface Materials
  • Videos
  • Avoid the Void

  • Indium Corporation's Product Manager for Engineered Solders Materials Tim Jensen discusses the issue of voiding in thermal management and how you can Avoid the Void®.


    Keywords: voiding, void, Avoid the Void, Heat-Spring, thermal interface materials, thermal management, conductivity, performance, grease, thermal cycling, CTE mismatch, voids, indium, Indium Corporation, Tim Jensen,,