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Indium Bonding and Indium Cold Welding

In recent days, one of my fellow applications engineers, Jim Hisert posted a blog on his semiconductor website about indium bonding and indium cold welding.  This is a topic that comes up often both in the semiconductor world as well as the thermal interface material world. 

 

In semiconductors, I believe the most common application for the indium bonding process is cold welding low temperature indium flip chip bumps  to an indium substrate.  In the thermal interface material world I commonly discuss this topic with engineers who want to use it to achieve a void-free, high reliable thermal interface material and solder TIMs are out of the question because these require the use of a flux.

 

For more information on the topic of indium bonding and indium cold welding, read through Jim's blog