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Indium Corporation Blog Posts
Performing die-attach using AuSn solder alloy preforms against gold plating? You may need an off-eutectic solder alloy to compensate for the Au that is scavenged from the plating during the reflow process get you back to 80Au/20Sn.
Indium Corporation presents paper at Advanced Technology Workshop that provdes metal thermal interface materials (TIMs) have a higher insertion rate and higher thermal conductivity than traditional TIMs for burn-in and test.
Folks, the adventures of The Professor continue. This blog post is a must-read if you are concerned about improving electronics assembly line productivity and uptime.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.