SOLDER Alloys
Indalloy®276
Indalloy®276 (SnSbAgCu) is a unique lead-free solder alloy engineered for power electronics, offering enhanced reliability and a wide service temperature range up to 175°C.
Powered by Indium Corporation
- High Reliability
- Pb-Free
- Available with InFORMS®, Preforms, and Ribbon
Product Overview
High Reliability at a Wider Service Temperature
Compared to commonly used SAC or SnSb alloys, Indalloy®276 offers consistent solderability in flux-free and conventional reflow applications. When operating temperatures exceed 150°C, Indalloy®276 has achieved superior life-cycle performance.
Pb-Free Technology
With a ROHS-compliant alloy composition, Indalloy®276 is an environmentally-friendly alternative to lead-based solders commonly used in power electronics packaging. With robust mechanical strength and proven reliability performance, Indalloy®276 can be introduced without sacrificing performance for many mission profiles and use case scenarios.
InFORMS® Complementary Technology
When paired with InFORMS®, Indalloy®276 significantly enhances design reliability. Its robust operating temperature range and reinforced matrix provide greater strength, making Indalloy®276 with InFORMS® the preferred choice for high-power density soldering in power electronics.
Available Configurations
When solder preforms are needed, Indalloy®276 offers a variety of sizes, thicknesses, and standard or custom shapes. Indalloy®276 is also available in ribbon, solder paste, and wire. Preform options include discs, squares/rectangles, washers, frames, and special shapes.
Quick Facts
Robust life cycle performance over a high service temperature range makes Indalloy® 276 the preferred soldering solution in power electronics applications.
Indalloy®276 Specifications
| Selected Properties | Metric |
|---|---|
| Liquidus | 233°C |
| Solidus | 224°C |
| Density | 7.32 g/cc |
| Thermal Conductivity | 56 W/mk |
| CTE | 23 ppm/°C |
| Poisson Ratio | 0.39 |
| Tensile Strength | 77 MPa |
| Yield Strength | 60 MPa |
| Elongation | 28% |
Product Data Sheets
Indium8.9HFRV (869-23-5) High-Reliability Alloy (Indalloy®292 and 276) Solder Paste PDS 99827 R3.pdf
Indium8.9HFRV (869-23-5) High-Reliability Alloy (Indalloy®292 and 276) Solder Paste PDS 99827 (A4) R3.pdf
Indium8.9HF High-Reliability (Indalloy®276) Solder Paste PDS 99936 R1.pdf
Indium8.9HF High-Reliability (Indalloy®292 and 276) Solder Paste PDS 99702 R6.pdf
Related Applications
Indalloy®276 is suitable for a variety of applications.
Die-Attach
Die-attach solutions include solder pastes to gold-based
Clip-Attach / Lead-Frame
Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and
Package-Attach
Wide selections to address the challenges in
Substrate/Spacer-Attach
Premier substrate-attach solutions in the power module
Semiconductor Packaging & Assembly
Critical semiconductor packaging ensures functionality and
Related Markets
Indalloy®276 is available for use in a wide range of applications.
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Indalloy®301LT
Indalloy® 301LT offers versatile solder forms & enhances reliability with lower processing temperatures using InFORMS®
Durafuse® HT
High-temperature Pb-free solder paste alloy Durafuse®
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