Flip-Chip Flux
The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
Flux Blog Posts
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
Soldering to Wood
Many surface finishes are solderable with the right flux. Many of our electronic devices use solder to bond copper, silver, gold, and other metals, but did you know that you can solder wooden surfaces too? Soldering to wood is easy with the correct flux. There are many great uses for wood bonding: Grounding…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
From One Engineer to Another®
Indium Corporation — ©1996–2013. All Rights Reserved. | Site Map
Connect with Indium
+ Read our latest posts!