Products Alloys Indalloy®276

Indalloy®276

Indalloy®276 (SnSbAgCu) is a unique lead-free solder alloy engineered for power electronics, offering enhanced reliability and a wide service temperature range up to 175°C.

Powered by Indium Corporation

  • High Reliability
  • Pb-Free
  • Available with InFORMS®, Preforms, and Ribbon
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High Reliability at a Wider Service Temperature

Compared to commonly used SAC or SnSb alloys, Indalloy®276 offers consistent solderability in flux-free and conventional reflow applications. When operating temperatures exceed 150°C, Indalloy®276 has achieved superior life-cycle performance.

Pb-Free Technology

With a ROHS-compliant alloy composition, Indalloy®276 is an environmentally-friendly alternative to lead-based solders commonly used in power electronics packaging. With robust mechanical strength and proven reliability performance, Indalloy®276 can be introduced without sacrificing performance for many mission profiles and use case scenarios. 

InFORMS® Complementary Technology

When paired with InFORMS®, Indalloy®276 significantly enhances design reliability. Its robust operating temperature range and reinforced matrix provide greater strength, making Indalloy®276 with InFORMS® the preferred choice for high-power density soldering in power electronics.

Available Configurations

When solder preforms are needed, Indalloy®276 offers a variety of sizes, thicknesses, and standard or custom shapes. Indalloy®276 is also available in ribbon, solder paste, and wire. Preform options include discs, squares/rectangles, washers, frames, and special shapes.

Quick Facts

Robust life cycle performance over a high service temperature range makes Indalloy® 276 the preferred soldering solution in power electronics applications.

175°C
0%

Indalloy®276 Specifications

Selected PropertiesMetric
Liquidus233°C
Solidus224°C
Density7.32 g/cc
Thermal Conductivity56 W/mk
CTE23 ppm/°C
Poisson Ratio0.39
Tensile Strength77 MPa
Yield Strength60 MPa
Elongation28%

Product Data Sheets

Indium8.9HFRV (869-23-5) High-Reliability Alloy (Indalloy®292 and 276) Solder Paste PDS 99827 R3.pdf
Indium8.9HFRV (869-23-5) High-Reliability Alloy (Indalloy®292 and 276) Solder Paste PDS 99827 (A4) R3.pdf
Indium8.9HF High-Reliability (Indalloy®276) Solder Paste PDS 99936 R1.pdf
Indium8.9HF High-Reliability (Indalloy®292 and 276) Solder Paste PDS 99702 R6.pdf

Related Applications

Indalloy®276 is suitable for a variety of applications.

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Die-Attach

Die-attach solutions include solder pastes to gold-based

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Clip-Attach / Lead-Frame

Applications Clip and Lead Frame Attach In power electronics packaging, clip-attach and lead-frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and

Exploded view of electronic components on a green background, showing circuit boards, copper connectors, and a central logo.

Package-Attach

Wide selections to address the challenges in

Spools of thin metal strips and sheets arranged on a grid-patterned surface.

Substrate/Spacer-Attach

Premier substrate-attach solutions in the power module

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Semiconductor Packaging & Assembly

Critical semiconductor packaging ensures functionality and

Related Markets

Indalloy®276 is available for use in a wide range of applications.

Do you have technical questions or sales inquiries? Our dedicated team is here to help. “From One Engineer to Another®” isn’t just our motto—it’s our commitment to delivering exceptional service. We’re ready when you are. Let’s connect!

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