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IMAPS 2014: See Indium Corporation at the International Symposium on Microelectronics

The 47th International Symposium on Microelectronics will be held in San Diego, CA, on October13th through the 16th, 2014. Here's the IMAPS 2014 program.

The Indium Corporation will be exhibiting there ... and ... :

  • I will be attending both as an exhibitor and as a session co-chair (Bonding Materials And Processes).
  • Our Dr. Ning-Cheng Lee will be presenting:
    • Professional Development Course:
      • Package on Package Technology – What It Is, What Works, What Doesn’t Work
    • Tech Papers:
      • Pressureless Sintering of Novel Ag Paste For Die Attach with Low Porosity - See more at: http://www.indium.com/imaps2014/#sthash.qUUGjTSI.dpuf
        Pressureless Sintering of Novel Ag Paste For Die Attach with Low Porosity
      • Reliability of PCB Solder Joints Assembled with SAC0510 Solder Paste

Indium Corporation will be showcasing materials for thermal and power electronics which include the following:

You can view more information on these materials here,

If you have not registered for the event please click here to register.  Register before September 12th and receive $100 off full price for early registration. 

Email me to make an appointment at the show or stop by our booth #217 (see image below) on October 14th or 15th with any questions.

I look forward seeing you at the show!

~Maria