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Flip-Chip Flux

Home » Products » Fluxes » Semiconductor Fluxes » Flip-Chip Flux

  • Flip-Chip Flux
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Flip-Chip STD

The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.

Copper pillar/solder microbumps are emerging as a standard flip-chip solder bump replacement in many parts of the semiconductor assembly industry, from standard chip-attach to power devices using flip-chip on leadframe as assembly technologies. For logic and similar devices, substrate metallization (landing pad) technology has also shifted from solder-on-pad (SoP), manufactured from printed and reflowed and cleaned solder paste, to individual solder balls. The technology is now moving to simple organic solderability protectant (OSP) on copper.

Water-soluble fluxes, which may be applied by dipping or spraying, have long been used in flip-chip assembly, but their long history of utility is coming to a close as a number of factors makes the move to no-clean inevitable in the high-volume sub-130micron copper pillar era.

The use of copper pillar instead of solder bumps has meant that chip-substrate clearances and finer pitches do not necessarily move in lock-step with each other. However, copper pillar heights of 40-60 microns (and even shorter than this in the near future) combined with fine pitch, makes cleaning extremely complex. Aqueous (water-based) cleaning becomes more complex with fine pitch flip-chip attach as it becomes increasingly difficult to get the cleaning solution under the chip to dissolve the residues, and then to carry the residue-containing solution out from under the chip.

A recent emerging failure mode caused by cleaning involves solder joint damage during aqueous jet impingement. This failure mode is believed to be driven by a combination of: very small diameter microbumps; the move from hemispherical to very thin solder microbumps on copper pillar (reduced joint compliance); and low CTE, low-cost, and low layer count (thinned) substrates. In these circumstances, a move towards an ultra-low residue no-clean flux is inevitable, although new failure modes continue to appear, being driven by the smaller dimensions. For this reason, Indium Corporation has introduced a new ultra-low (ULR) flux called NC-26-A for both current and emerging applications.

Standard WLCSP and Flip-Chip Processes

Related Markets and Applications

  • Ultra-Low Residue Flip-Chip Flux NC-26-A
  • Semiconductor Materials
  • Die-Attach

Equipment Partners

2.5D, 3D

  • Toray
  • Shibuya
  • Shibaura

Flip-Chip

  • Heller
  • BTU
  • BESi/Datacon
  • Finetech

Flip-Chip Flux Technical Documents

Whitepapers

Request This Document

Solder Bumping Via Paste Reflow For Area Array Packages

Authors: Dr. Ning-Cheng Lee

Request This Document

Soldering Technology for Area Array Packages

Authors: Dr. Ning-Cheng Lee

Presentations

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Application Notes

Storage and Handling of Specialty Fluxes (US Letter)

Product Data Sheets

Flip-Chip Flux NC-26-A (US Letter) (A4)
Flip-Chip Flux NC-510 (US Letter) (A4)
Flip-Chip Flux NC-699 (US Letter) (A4)
Flip-Chip Flux NC-826 (US Letter) (A4)
Flip-Chip Flux WS-3555 (US Letter) (A4)
Flip-Chip Flux WS-446 (US Letter) (A4)
Flip-Chip Flux WS-575-SP (US Letter) (A4)
Flip-Chip Flux WS-641 Cu-Pillar (US Letter) (A4)
Flip-Chip Flux WS-688 (US Letter) (A4)
WS-446HF Flux (US Letter) (A4)

Safety Data Sheets

Flip-Chip FC-MC-M
Flip-Chip FC-NC-HT-A1
Flip-Chip FC-NC-HT-C
Flip-Chip FC-NC-HT-D
Flip-Chip FC-NC-LT-B
Flip-Chip FC-NC-LT-D
Flip-Chip FC-WS-HT-A1
Flip-Chip FC-WS-HT-D
Flip-Chip FC-WS-LT-B
Flip-Chip Flux NC-826
NC-510 Flip-Chip Flux
Flip-Chip FC-NC-HT-A
Flip-Chip FC-NC-HT-B
Flip-Chip FC-NC-HT-CA
Flip-Chip FC-NC-LT-A
Flip-Chip FC-NC-LT-C
Flip-Chip FC-WS-HT-A
Flip-Chip FC-WS-HT-B1
Flip-Chip FC-WS-LT-A
Flip-Chip FC-WS-LT-C
H-208-X4 Flux

View All

Flux Blog Posts

Semiconductor Fluxes: Part 3

21 Oct 2019 by Meagan Sloan [view bio]

Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.

Read More

Semiconductor Fluxes: Part 2

17 Oct 2019 by Meagan Sloan [view bio]

This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes.

Read More

Semiconductor Fluxes: Part 1

15 Oct 2019 by Meagan Sloan [view bio]

If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products.

Read More

View All Blog Posts

For comments or questions about the content on this page, please contact:

Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com

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Related to Flip-Chip Flux

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  • Epoxy Flux
  • TCP & Copper Pillar Flux

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