Flip-Chip Flux
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Flux Blog Posts
Semiconductor Fluxes: Part 3
Part 3 of the semiconductor flux series talks about the important cleaning function of fluxes and how thermocompression bonding can help prevent warpage and die tilt.
Semiconductor Fluxes: Part 2
This is the second in a series of posts about semiconductor fluxes, and talks about the optimal dipping depth for flip-chip fluxes.
Semiconductor Fluxes: Part 1
If you are a little intimidated by semiconductor products, this blog post provides a simple explanation to help you better understand these products.
For comments or questions about the content on this page, please contact:
Andy C. Mackie, PhD, MSc
Senior Product Manager,
Semiconductor Assembly Materials
amackie@indium.com
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