Andy C. Mackie, PhD, MSc
Global Product Manager
Semiconductor and Advanced Assembly Materials
Indium Corporation
Ph: +1.315.853.4900 x7549
E-mail: amackie@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323
Blog
Biography
Dr. Andy C. Mackie is the Global Product Manager for Indium Corporation's Semiconductor and Advanced Assembly Materials and the author of the Semiconductor Assembly Blog. His product lines include:
- Wafer bumping fluxes
- 3D interconnect fluxes
- Wafer-level chip-scale packaging fluxes
- Epoxy fluxes
- Package-on-package (PoP) fluxes
- Ball-attach fluxes
- Low and ultralow alpha (LA, ULA) solder pastes
- PoP solder pastes
- Wafer and substrate bumping solder pastes
- Transient liquid phase materials
- Die-attach solder pastes
- Die-attach solder wire
- Specialty and micro solder spheres
Andy has over 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including:
- Wafer fabrication
- Electronics assembly
- Semiconductor packaging
Andy is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow.
Andy’s industry involvement includes:
- Editorial review board member for Chip Scale Review magazine [2008-Present]
- SMTA member and frequent invited speaker [1998-Present]
- Member of the Technical Advisory Committee for the annual International Waferlevel Packaging Conference (IWLPC) run by the SMTA [2009-Present]
- Member of the Assembly and Packaging Subgroup of the ITRS
- Member of SEMI, JEDEC, SMTA
Past involvement:
- Past Chair of the iNEMI/DOE SSL/LED Roadmap Task Group [Level 1 Assembly] [2010]
- Past VP Technical Programs for Empire (NY) State Chapter of SMTA [2010]
- Past Chair of IPC Solder Paste Task Group (responsible for J-STD-005) [1996-2001]
- Past Vice-Chair of IPC Assembly and Joining Materials Subcommittee [1998-2002]
Andy received the prestigious IPC President's Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials sub-committee.
Andy has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues.
Additionally, Andy holds patents in novel polymers, gas analysis, and solder paste formulation and is trained in Six Sigma - Design of Experiments.
Andy has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK.
