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Preforms

Home » Products » Solders » Preforms

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Preforms

Solder Preforms are used in a variety of applications that require precise amounts of solder.

Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy.

Selecting Alloys

A wide assortment of alloys is available in liquidus temperatures that range from 47°C to 1063°C. Alloys can be indium-contained, gold-contained, lead-free, fusible or standard tin-lead, as well as many others.

  1. Alloy selection should be based on strength and other required physical properties, as well as the preferred soldering temperature and the operating temperature of the device being soldered. A general rule is to select an alloy that melts at least 50°C higher than the operational temperature of the part being soldered.
  2. Next, consider the materials being soldered and what solder is most compatible with them. For example, tin-based solders will scavenge the gold from gold-plated parts, forming brittle intermetallics, so indium-based solders are generally recommended in these cases.
  3. Metals and alloys have different characteristics that can affect the ease with which they can be made into different shapes and thicknesses. It is important to consider the shape of the final preform in the alloy selection process.
  4. The operating environment of the completed assembly is also an important consideration for alloy selection. Will it operate in very high or very low temperatures, or be subjected to vibration? If so, you need to select an alloy that will stand up to these conditions.

Our Application Engineers will work with you to determine the best alloy for your application.

Selecting Dimensions

The location of the solder joint and the volume of solder needed will determine the size and shape of the preform. Once the flat dimensions (diameter, length, width) have been determined, the thickness can be adjusted to achieve the desired volume of solder. Generally, for through-hole connections, add 10-20% to the calculated volume for a good fillet. For pad to pad joints, figure about 5% less surface area than the pad.

Each Solder Preform should have a burr tolerance specified. You should stay as close to standard tolerances as possible to avoid adding cost and lead time to your preforms.

Indium Corporation has an extensive library of sizes and shapes from which you can choose, or we can create a set-up specifically for your application. Using an existing preform size can eliminate the additional time associated with creating a new set-up.

Packaging and Storage

Solder Preforms come in a variety of packaging options, including tape and reel. To minimize excessive handling, and exposure to air and subsequent oxidation, Solder Preforms should be packaged according to the quantity used during a typical work shift.

Store in the original container, closed securely, in 55% RH or less and at temperatures less than 22°C. Solder Preforms can also be stored in an inert atmosphere, such as a nitrogen dry box.

Shelf Life

The shelf life of solder preforms is dependent on the alloy composition. Pb-free alloys, and alloys with lead content of less than 70%, have a shelf life of 1-year from the date of manufacture (DOM). Alloys with lead content >70% have a shelf life of 6-months from the DOM.

Dimensional Specification Recommendations

Width/length or diameter: Typical Tolerances
Up to .100" (2.54mm) ±.002"(± .051mm)
Over .100" (2.54mm) ± .005" (± .127mm)
Thickness:  
Up to .001" (.025mm) ± .0002" (.005mm)
.001" (.025mm) to .002" (.050mm) ± .0003" (.0076mm)
> .002" (.050mm) to .010" (.254mm) ± .0005" (.0127mm)
> .010" (.254mm) to .020" (.508mm) ± .0010" (.0254mm)
> .020" (.508mm) to .050" (1.27mm) ± .0025" (.0635mm)
> .050" (1.27mm) ± 5%
Burr Tolerances (Discs, Squares & Rectangles):  
≤.050" (1.27mm) .002" (.050mm)
>.050" (1.27mmm) to .500" (12.7mm) .003" (.076mm)
>.500" (12.7mm) .005" (.127mm)
Burr Tolerances (Washers & Frames):  
≤.100" (2.54mm) .003" (.076mm)
When thickness ≥ 2/3 of I.D. .005" (.127mm)

Flux Coatings for Solder Preforms

Solder Preform Flux Coating

Features

  1. Eliminates the need for manual fluxing
  2. Eliminates excessive flux residue
  3. Increases productivity
  4. Applies flux precisely where it is needed
  5. Applies a uniform amount every time

Introduction

Flux Coated Preforms eliminate the costly production step of separate fluxing and increase throughput yields. Flux Coatings for Preforms are available in no-clean and rosin-based chemistries with a variety of activity levels to suit your substrate metallizations.

Flux Coatings

Indium Corporation’s unique coating process can control the amount of flux to tight tolerances. Flux Coatings are measured and applied by weight percentage. The coatings range from 1-3% and standard tolerances are controlled at +/- .5%. Coatings can be applied to most sizes and shapes of preforms.

Flux IPC Classification Substrate Finishes Reliability J-STD-004
NC-7 ROL0 Au,Ag,Pd,Pt,Cu Pass
NC-9 ROL1 Sn,NiAu,SnPb,Cu Pass
R ROL0 Au,Ag,Pd,Pt Pass
RMA ROL0 Sn,NiAu,SnPb,Cu Pass
RA ROL1 Cu,Ni, Cu Alloys (Brass, Bronze) Cleaning Recommended
RSA ROL1 Cu,Ni, Cu Alloys (Brass, Bronze) Cleaning Recommended
  • Integrated Array
  • Clad Preforms
  • Flux-Coated Preforms
  • Gold Solders

Related Markets and Applications

  • Engineered Solder and Alloys
  • Solder Paste and Powders
  • Thermal Management

Top Preforms Technical Documents

  • Solder Alloy Chart (Letter)

    Product Data Sheet

  • Solder Fortification® Preforms (Letter) (A4)

    Product Data Sheet

  • Clad Solder Preforms (Letter) (A4)

    Product Data Sheet

Preforms Technical Documents

Whitepapers

Request This Document

A Quick Guide to Solder Preforms

Authors: James Slattery, Paul Socha

Posted on 10 Mar 2010

Request This Document

Applications of Solder Fortification® With Preforms

Authors: Carol Gowans, Dr. Ronald C. Lasky, Paul Socha

Posted on 11 Apr 2011

Request This Document

Eliminate Lead-free Wave Soldering (English)

Authors: Karl Pfluke, Richard H. Short

Posted on 1 Jan 2009

Request This Document

Eliminate Lead-free Wave Soldering (German)

Authors: Karl Pfluke, Richard H. Short

Posted on 1 Jan 2009

Request This Document

How to Reduce Voiding in Components with Large Pads

Authors: Wisdom Qu

Posted on 26 Sep 2012

Request This Document

How to Reduce Voiding in Components with Large Pads (Chinese)

Authors: Wisdom Qu

Posted on 26 Sep 2012

Request This Document

Process and Reliability Advantages of AuSn Eutectic Die-Attach

Authors: Amanda Hartnett, Steve Buerki

Posted on 5 Nov 2009

Request This Document

Solder Preform Basics (English)

Authors: Paul Socha

Posted on 9 Mar 2010

Request This Document

Through-Hole Assembly Options for Mixed Technology Boards

Authors: Dr. Ronald C. Lasky, Karl Pfluke, Ross B. Berntson

Posted on 1 Jan 2009

View All

Application Notes

Flux-Coated Solder Preforms: Potential Process Issues, Causes, and Solutions (Letter)
Storage and Handling of Flux-Coated Preforms (Letter)
Storage and Handling of Solder Preforms, Wire and Ribbon (Letter) (A4)
Using Flux-Coated Preforms in Soldering (Letter)

Product Data Sheets

Clad Solder Preforms (Letter) (A4)
Eutectic Gold/Tin Solder (Letter) (A4)
Flux Coatings for Solder Preforms (Letter)
InFORMS® (Letter)
InTEGRATED® Preforms (Letter)
Pb-Free Solder Fabrications (Letter)
Solder Alloy Chart (Letter)
Solder Fortification® Preforms (Letter) (A4)
Solder Preforms (Letter) (A4)
Tape and Reel Preforms (Letter) (A4)

View All

Material Safety Data Sheets

Indalloy® 128 (Tin)
Indalloy® 176 (Zinc Metal Mix)
Indalloy® 207
Indalloy® Containing Indium with Tin, Lead, Silver, Copper
Indalloy® Tin and Lead Only
Indalloy® with Lead, Zinc and Antimony
Indalloy® 170 (Lead)
Indalloy® 193
Indalloy® 4 (Indium)
Indalloy® Indium with Tin, Lead or Silver
Indalloy® with Lead and/or Tin and/or Silver and Antimony
Indalloy® with Tin, Lead and/or Silver and/or Copper

View All

Solder Preform Blog Posts

Measuring Void Content and Further Global Warming Musings

Monday, April 15, 2013 by Dr. Ron Lasky [view bio]

Folks,   A reader writes: Dear Dr. Ron, I need to measure the void content of an alloy.  Is there an easy way to do it? After a little thought, it occurred to me that the densities of the voided and unvoided material will likely hold the answer.  I derived the result below. …

Leadframe Solderability Issues in Power Semiconductors

Friday, April 05, 2013 by Dr. Andy Mackie [view bio]

It is no secret that automotive semiconductor customers are becoming increasingly demanding. The "under the hood / bonnet" electronics environment is arguably one of the most thermally stressful environments on the planet. Electronics close to the engine block can experience extremes ranging…

The Magic of Engineered Solders

Friday, April 05, 2013 by Seth Homer [view bio]

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…

View All Blog Posts

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Jordan Ross

This page is owned by:

Jordan Ross
Senior Product Manager, Engineered Solders and Thermal Materials
jross@indium.com

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