“Comparing Package Bond Thermal Performance” by John Parry (Mentor Graphics Corp.) is the final article of Advanced Packaging week. Speaking for our thermal team, I’m sure they would love to see this system used to model CPUs and GPUs with and without Indium thermal interface materials. If anyone out there is interested in Indium thermal materials, send us an email.
Advanced Packaging Week (Day 5)
Indium Corporation Blogging Team
Indium Corporation Blogging Team
Our blogging team includes engineers, researchers, product specialists, and industry leaders. We share expertise in solder materials, electronics assembly, thermal management, and advanced manufacturing. Our blog offers insights, technical knowledge, and solutions to inspire professionals, showcasing product innovations, trends, and best practices to help readers excel in a competitive industry.
