Indium Corporation‘s Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, Voiding Control for QFN Assembly, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, January 18-20, 2011.
Voiding Control for QFN Assembly will explore advanced technology solutions for reduced voiding. The paper will be presented as part of session TA2: Materials Advances: Connections Tuesday, January 18th.
Indium Corporation is also a sponsor of the symposium.
Sponsored by the SMTA, the Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. For more information visit, www.smta.org/panpac/.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr. Lee resides in Clinton, NY.
A Indium Corporation é um dos principais fornecedores de materiais para os mercados globais de eletrónica, semicondutores, energia solar, película fina e gestão térmica. Os produtos incluem soldas, pré-formas e fluxos; brasagens; alvos de pulverização; produtos químicos e fornecimento de índio, gálio e germânio; e Reactive NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Singapura, Coreia do Sul, Reino Unido e EUA.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected].
