Comunicados de imprensa

Indium Corporation’s experts met with several industry media outlets during IPC APEX Expo 2020 from Feb. 1-6 in San Diego, Calif.,

Indium Corporation will feature its high-reliability solder paste and innovative alloy pairing, which provides enhanced performance in automotive applications, at SMTconnect, May 5-7,

Indium Corporation will feature its reclaim and recycle services for indium-containing materials at SVC TechCon 2020, April 18-23, in Chicago, Ill., USA.   Indium Corporation is a

Two of Indium Corporation’s experts will share their insights at SVC TechCon 2020, April 18-23, 2020, in Chicago, Ill., USA. Indium is viewed as a critical metal for the

Indium Corporation's Miloš Lazi, Technical Support Engineer will present on metal thermal interface materials during the 36th Annual Semiconductor Thermal Measurement,

Indium Corporation will feature its high-performance liquid metal thermal interface materials (TIMs) at the 36th Annual Semiconductor Thermal Measurement, Modeling and Management

Indium Corporation, Utica's Technology Company®, is proud to announce the hiring of three new employees to its Quality and Inside Sales departments. David Sgroi and Marianne Brown have

Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA

Indium Corporation will feature its portfolio of high-reliability solutions for power electronics at the Applied Power Electronics Conference (APEC), March 15-19 in New Orleans, La.,

Indium Corporation's Andreas Karch, Regional Technical Manager for Germany, Austria, and Switzerland, will present at the EPP InnovationsFORUM Germany on March 5 in

In January, Indium Corporation partnered with Finetech for MIT’s Integrated Photonics Bootcamp, a week-long, hands-on learning experience held at

Indium Corporation’s Miloš Lazi, Technical Support Engineer, was honored with a special recognition award at IPC APEX Expo 2020 on February 5 in San Diego, Calif., USA. Lazi

Indium Corporation has earned the CIRCUITS ASSEMBLY New Product Introduction (NPI) Award for its low-temperature alloy technology, Durafuse™ LT at the IPC APEX

Indium Corporation will feature more than a dozen of its high-reliability products live on the IPC APEX Expo show floor, giving conference attendees opportunities to witness them in

Indium Corporation’s Tim Jensen, Senior Product Manager, Solder Preform and Thermal Technology, will present on metal thermal interface materials during the IMAPS European

Indium Corporation, Utica’s Technology Company®, is proud to announce the promotion of Jonathan Minter to the position of Research Chemist. Jonathan is based at the company’s Clinton

Indium Corporation continues to develop innovative solder paste solutions to fit customers' needs. PicoShot™ NC-5M is designed for customers needing a no-clean halogen-free

Indium Corporation will feature its precision AuSn preforms for die-attach applications at SPIE Photonics West, Feb. 1-6, in San Francisco, Calif., USA. Indium Corporation’s AuLTRA™

Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb. 1-6, in San Diego, Calif., USA. The following technical papers from Indium Corporation experts

Indium Corporation will feature its metal thermal interface materials (TIMs) for burn-in and test at TestConX, May 10-13 in Mesa, Arizona, USA. Indium Corporation’s wide portfolio of

 Indium Corporation’s Ross Berntson, President and COO, will deliver the keynote presentation at TestConX, to be held May 10-13, 2020 in Mesa, Arizona, USA. Berntson will be presenting on