Indium Corporation expert Seth Homer, Product Manager, Engineered Solders, will present at International Microwave Symposium from June 2-7, in Boston, Massachusetts, USA.
Homer will present Materials and Techniques for Void Reduction Under Bottom Termination Components. The paper discusses how voiding is challenging demands for increased reliability and performance, especially as the industry moves toward new 5G platforms. As a solution to excessive voiding between the thermal pad on the QFN and PWB pad, he examines how Indium Corporation’s flux-coated solder preforms have been used to significantly reduce voiding while providing extra benefits to enhance final product reliability.
Homer has worked with Indium Corporation for more than 25 years, serving in both manufacturing operations and marketing roles. He is responsible for many of the products within the engineered solders product offering especially as it relates to the IGBT and power electronics industries. He travels to customer sites globally to gain industry insight and works closely with Indium Corporation’s manufacturing teams to help support current production demand and future product development.
For more information on Indium Corporation’s flux-coated solder preforms, visit indiumstg.wpenginepowered.com/flux-coated-preforms or visit Indium Corporation’s booth #691.
Indium Corporation là nhà sản xuất và cung cấp vật liệu hàng đầu cho các thị trường điện tử, bán dẫn, màng mỏng và quản lý nhiệt toàn cầu. Các sản phẩm bao gồm chất hàn và chất trợ dung; hàn đồng; vật liệu giao diện nhiệt; mục tiêu phun; kim loại indium, gali, germani và thiếc và các hợp chất vô cơ; và NanoFoil ® . Được thành lập vào năm 1934, công ty có hỗ trợ kỹ thuật toàn cầu và các nhà máy đặt tại Trung Quốc, Malaysia, Singapore, Hàn Quốc, Vương quốc Anh và Hoa Kỳ.
For more information about Indium Corporation, visit indiumstg.wpenginepowered.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.
