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Kẹp và Khung chì đính kèm

In power electronics packaging, clip-attach and lead frame attach are two methods used to bond pre-fabricated copper frames, enabling efficient internal and external interconnections. Clip-attach typically connects the top of the semiconductor die to the substrate, while lead-frame attach extends beyond the package to create external electrical connection terminals. The choice of bonding material is crucial for enhancing yield and overall performance.