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Indium Corporation, Utica's Technology Company®, announces the addition of 12 summer interns in various departments throughout their local

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015

Indium Corporation’s newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC

Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY),

Indium Corporation’s Aaron Yan, Area Technical Manager – Eastern China, will present at the IPC Shanghai Technology Seminar on July 17 in Shanghai, China. Yan’s

Indium Corporation's Pony Liao, Area Technical Manager – Northern China, will present a technical paper at the IPC Beijing Technology Seminar on June 19 in Beijing, China.

Indium Corporation announces that Sehar Samiappan has been appointed Regional Manager for Northern California. In his new role, Samiappan will be responsible for growing Indium

Indium Corporation's Raymond Luo, Area Technical Manager – South China, presented at the IPC Dongguan Seminar on April 24 in Dongguan City, China. Luo's

Indium Corporation’s Alvin Zhang, Area Technical Manager – Central China, presented at the IPC Xi'an Technology Seminar on May 20 in Xi’an, China. Zhang’s

Indium Corporation, Utica's Technology Company™, has hired Marlene Natale as a Supplier Quality Engineer. Natale will be responsible for quality assurance leadership in strategic

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision

Indium Corporation and the SMTA Empire Chapter will host a technical event on May 13 at SUNY Polytechnic Institute in Marcy, N.Y. The event will include an address

Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, moderated a technical session at the 2015 Automotive Electronics

Indium Corporation, Utica's Technology Company™, announces the promotion of Herbert Ludowieg to Product Specialist for Engineered Solders. Ludowieg will act as a technical liaison

Indium Corporation, Utica's Technology Company™, announces the promotion of Christopher Nash to PCBA New Product Development Manager. Nash will be responsible for proactively

Indium Corporation's Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Electronic Components and Technology Conference (ECTC) May 26-29 in San Diego, Calif. Dr.

Indium Corporation's Malcolm Harrower, compounds global sales manager, will present at the Minor Metals Trade Association (MMTA) Conference April 27-29 in Toronto, Canada.

Indium Corporation will be featuring Heat-Spring® for IGBT Assembly at PCIM. Indium Corporation's Heat-Spring is a compressible soft metal shim that serves as a thermal

Indium Corporation's Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, and Graham Wilson, Applications Engineer, will give poster presentations at PCIM

Indium Corporation, Utica's Technology Company™, will host a job fair on April 25 from 10 a.m.-4 p.m. at the Oneida-Herkimer-Madison BOCES, 4747 Middle Settlement Road, New Hartford.

Indium Corporation's Tim Jensen, senior product manager for engineered solders, and Maria Durham, technical support engineer for semiconductor and advanced assembly materials, have been