Indium Corporation has released NC-702, a no-clean, near-zero residue, halogen-free adhesive solution designed for holding parts in place during placement and reflow processes.
Designed for use in a formic acid reflow environment, NC-702 is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution over pick and place investments. While NC-702 has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps. Benefits include:
- No evidence of contamination during reflow, enabling use in formic acid reflow environments without risk of damaging equipment
- Flexible application method via dipping, dispensing, or jetting, potentially reducing process costs
- Minimal voiding present and good soldering performance; although classified as an adhesive solution, NC-702 does not negatively affect soldering performance
- Compatible with molding and underfill material
- Compatible with most common SAC alloys
For more information about NC-702, contact Indium Corporation Product Specialist Evan Griffith
Sobre a Indium Corporation
A Indium Corporation é um dos principais refinadores, fundidores, fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para Jingya Huang. Também pode seguir os nossos especialistas, From One Engineer To Another (#FOETA), em www.linkedin.com/company/indium-corporation/ ou @IndiumCorp.
