Indium Corporation has released NC-702, a no-clean, near-zero residue, halogen-free adhesive solution designed for holding parts in place during placement and reflow processes.
Designed for use in a formic acid reflow environment, NC-702 is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, creating a low-cost tooling-free solution over pick and place investments. While NC-702 has the tack strength to hold materials in place, the material is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps. Benefits include:
- No evidence of contamination during reflow, enabling use in formic acid reflow environments without risk of damaging equipment
- Flexible application method via dipping, dispensing, or jetting, potentially reducing process costs
- Minimal voiding present and good soldering performance; although classified as an adhesive solution, NC-702 does not negatively affect soldering performance
- Compatible with molding and underfill material
- Compatible with most common SAC alloys
For more information about NC-702, contact Indium Corporation Product Specialist Evan Griffith
關於 Indium Corporation
Indium Corporation 是全球電子、半導體、薄膜和熱管理市場的主要材料精煉商、冶煉商、製造商和供應商。產品包括焊料和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil 。公司成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、德國、印度、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件給Jingya Huang。您也可以透過www.linkedin.com/company/indium-corporation/或@IndiumCorp 追蹤我們的專家，From One Engineer To Another (#FOETA)。
