Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions:
Heat-Spring® HSx (New)
- Newest pattern designed for large area dies with warpage >200 microns
- Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
- Designed for test heads where clamping forces are limited to <30psi
- Thickness ranging from 300 micron up to 1mm
- Available with or without a diffusion barrier to prevent staining of the die
Heat-Spring® HSD
- The original and best standard option for interfaces with flat, smooth, and parallel surfaces
- Được thiết kế cho các giao diện có bề mặt kiểm soát chặt chẽ >30psi
Heat-Spring® High Profile Preforms
- Được thiết kế để tối ưu hóa tiếp xúc với các bề mặt không phẳng, cung cấp 86W/mK
- Ideal for assemblies with an extruded, unfinished heat-sink
- Recommended for immersion cooling and burn-in applications
- Cung cấp sự tiếp xúc đồng đều giữa đầu đốt và DUT
- Cung cấp độ dẫn nhiệt đồng đều hơn
Heat-Spring® HSK
- Được khuyến nghị đặc biệt cho các ứng dụng chạy rà khi cần chèn nhiều lần
- Cung cấp tiếp xúc đồng đều với điện trở thấp cho tải nhiệt mật độ cao
- Thông thường được phủ một lớp rào cản khuếch tán mỏng, đóng vai trò là bề mặt tiếp xúc cho các ứng dụng thử nghiệm và đốt cháy
- Không bị ố màu hoặc nứt
All Heat-Spring® products are recyclable and reclaimable.
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
