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Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona. 

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions: 

Heat-Spring® HSx (New) 

  • Newest pattern designed for large area dies with warpage >200 microns 
  • Effective thermal conductivity of 16W/m-K at only 20psi with pure indium 
  • Designed for test heads where clamping forces are limited to <30psi 
  • Thickness ranging from 300 micron up to 1mm 
  • Available with or without a diffusion barrier to prevent staining of the die  

Heat-Spring® HSD 

  • The original and best standard option for interfaces with flat, smooth, and parallel surfaces 
  • 专为具有严格表面控制 >30psi 的接口而设计 

Heat-Spring® High Profile Preforms 

  • 图案设计优化了与非平面表面的接触,可提供 86W/mK 的功率 
  • Ideal for assemblies with an extruded, unfinished heat-sink 
  • Recommended for immersion cooling and burn-in applications 
  • 在预烧头和 DUT 之间提供均匀接触 
  • 提供更均匀的导热性 

Heat-Spring® HSK 

  • 特别推荐用于需要多次插入的预烧应用 
  • 为高密度热负荷提供低阻力的均匀接触 
  • 通常覆有一层薄薄的扩散屏障,作为预烧和测试应用中的接触面 
  • 无染色或开裂 

All Heat-Spring® products are recyclable and reclaimable. 

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.

About Indium Corporation 

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. 

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.