Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions:
Heat-Spring® HSx (New)
- Newest pattern designed for large area dies with warpage >200 microns
- Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
- Designed for test heads where clamping forces are limited to <30psi
- Thickness ranging from 300 micron up to 1mm
- Available with or without a diffusion barrier to prevent staining of the die
Heat-Spring® HSD
- The original and best standard option for interfaces with flat, smooth, and parallel surfaces
- Diseñado para interfaces con control de superficie ajustado >30psi
Heat-Spring® High Profile Preforms
- Diseñado para optimizar el contacto con superficies no planas que proporcionan 86 W/mK
- Ideal for assemblies with an extruded, unfinished heat-sink
- Recommended for immersion cooling and burn-in applications
- Proporciona un contacto uniforme entre el cabezal de quemado y el DUT
- Proporciona una conductividad térmica más uniforme
Heat-Spring® HSK
- Recomendado específicamente para aplicaciones de quemado en las que se requieren múltiples inserciones
- Proporciona un contacto uniforme con baja resistencia para cargas térmicas de alta densidad
- Normalmente revestido con una fina barrera de difusión, que sirve como superficie de contacto para aplicaciones de ensayo y quemado.
- Sin manchas ni grietas
All Heat-Spring® products are recyclable and reclaimable.
To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
Para obtener más información sobre Indium Corporation, visite www.indium.com o envíe un correo electrónico a [email protected]. También puede seguir a nuestros expertos, From One Engineer ToAnother® (#FOETA), en www.linkedin.com/company/indium-corporation/.
