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Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona. 

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions: 

Heat-Spring® HSx (New) 

  • Newest pattern designed for large area dies with warpage >200 microns 
  • Effective thermal conductivity of 16W/m-K at only 20psi with pure indium 
  • Designed for test heads where clamping forces are limited to <30psi 
  • Thickness ranging from 300 micron up to 1mm 
  • Available with or without a diffusion barrier to prevent staining of the die  

Heat-Spring® HSD 

  • The original and best standard option for interfaces with flat, smooth, and parallel surfaces 
  • 30psi以上のタイトなサーフェス制御を必要とするインターフェイス用に設計。 

Heat-Spring® High Profile Preforms 

  • 86W/mKを提供する非平面表面との接触を最適化するパターン化 
  • Ideal for assemblies with an extruded, unfinished heat-sink 
  • Recommended for immersion cooling and burn-in applications 
  • バーンインヘッドとDUTを均一に接触させます。 
  • より均一な熱伝導性を提供 

Heat-Spring® HSK 

  • 複数回の挿入が必要なバーンイン用途に特に推奨 
  • 高密度熱負荷に低抵抗で均一な接触を提供 
  • 通常、薄い拡散バリアで覆われており、バーンインやテスト用途の接触面として機能する。 
  • シミやひび割れがない 

All Heat-Spring® products are recyclable and reclaimable. 

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.

About Indium Corporation 

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. 

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.