プリント基板（PCB）アセンブリ

Achieving efficiency, reliability, and exceptional thermal performance is crucial in package-attach soldering applications for power modules. However, the high reflow temperatures required by

With the 4 Nations Face-Off hockey tournament held just recently in Canada and Boston, Massachusetts gained a lot of publicityfor its intensity and high level of play, and arguably pushed the NHL to

During my first few weeks as a Technical Support Engineer at Indium Corporation, Iresearched extensively and consulted with my team to find out when flux should be used and why it’s essential

Folks, Let's see how Monica and Guy are doing in solving the too-high temperature reflow concern….. Patty was sitting in her office, and, typical to her dynamic personality, was excited and

Folks, Professor Patty Coleman is at it again. Let's listen in….. Monica Reese was conflicted as she sat at her desk. She was excited that Professor Patty Coleman helped her get a job with

Folks, I am working on a book with my Indium Corporation colleagues on tackling soldering defects in electronics.It is a follow up to our The Printed Circuits Assembler's Guide to Solder Defects.

「ソルダーペーストの調合に欠かせない重要な成分はロジンであり、ソルダーペーストの性能を向上させる上で重要な役割を果たしている。

夏の間、人はカヤックや海水浴、釣り、あるいは単に時間を過ごすことを考えているかもしれない。

みなさん、ちょっと山小屋フィーバーになってきたので、サイモン・ピアースにランチを食べに行こうと思いました。あそこの雰囲気はいつも私をリラックスさせ、リフレッシュさせてくれる。それで、マイスターが私を小上がりの席に案内してくれた。