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Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona. 

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions: 

Heat-Spring® HSx (New) 

  • Newest pattern designed for large area dies with warpage >200 microns 
  • Effective thermal conductivity of 16W/m-K at only 20psi with pure indium 
  • Designed for test heads where clamping forces are limited to <30psi 
  • Thickness ranging from 300 micron up to 1mm 
  • Available with or without a diffusion barrier to prevent staining of the die  

Heat-Spring® HSD 

  • The original and best standard option for interfaces with flat, smooth, and parallel surfaces 
  • 30psi 이상의 엄격한 표면 제어가 필요한 인터페이스를 위한 설계 

Heat-Spring® High Profile Preforms 

  • 비평면 표면과의 접촉을 최적화하도록 패턴화되어 86W/mK를 제공합니다. 
  • Ideal for assemblies with an extruded, unfinished heat-sink 
  • Recommended for immersion cooling and burn-in applications 
  • 번인 헤드와 DUT 사이에 균일한 접촉을 제공합니다. 
  • 보다 균일한 열 전도성 제공 

Heat-Spring® HSK 

  • 여러 번 삽입해야 하는 번인 애플리케이션에 특히 권장됩니다. 
  • 고밀도 열 부하에 대해 낮은 저항으로 균일한 접촉을 제공합니다. 
  • 일반적으로 번인 및 테스트 애플리케이션의 접촉면 역할을 하는 얇은 확산 장벽으로 덮여 있습니다. 
  • 얼룩이나 균열 없음 

All Heat-Spring® products are recyclable and reclaimable. 

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at https://www.indium.com/products/thermal-interface-materials/.

About Indium Corporation 

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S. 

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.