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Sean McKenna: Preventative Maintenance Intern

Hello, As this internship progresses I will be posting on my experience and documenting my progress, so it is prudent that I first introduce

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Primeira semana do meu estágio de verão universitário de 2016 na Indium Corporation

Hello, my name is John Russo and I’m currently a student at SUNY Polytechnic working diligently to get a bachelor’s degree in Mechanical Engineering Tech. I’m involved in many

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Joining the Indium Corporation Team As A Production Engineering Intern

First off, I would like to say how grateful I am to be an intern here at the Indium Corporation. This is a great oppurtunity and I look forward to learning many things. I was born and raised in

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Marketing Communications Intern at Indium Corporation: Introduction

Dear Future Interns, Hello! My name is Lucia Forte. I am the Marketing Communications (also known as Marcom) intern at Indium Corporation. I am currently studying New Media Marketing at Rochester

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Tal como acontece com a anulação, ao utilizar tecnologia mista, comece com uma boa pasta de soldadura

Patty estava a caminhar para o seu gabinete quando viu passar o Professor Ulf Gabrielson. "Que velhote impressionante", pensou. Tinha sido candidato a um Prémio Nobel há algumas décadas e

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Os PCs, os Tablets e os telemóveis não estão a morrer e continuarão a representar desafios para o Voiding

Pessoal, parece que a Patty e o Rob estão noutra aventura. Vamos dar uma olhadela em ..... A Patty conduzia a mesma carrinha Saab de 2001 desde a faculdade. Tinha sido um ótimo carro, mas, com quase

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AVOID THE VOID®: Grandes lacunas no plano de terra na montagem de componentes eletrónicos: Conceção de placas de circuito impresso

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

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AVOID THE VOID®: Large Ground Plane Voiding in Electronics Assembly: Reflow Profile

In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an

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História e aplicações do índio metálico

Phil Zarrow: Este vídeo destina-se a investigadores e engenheiros interessados no índio metálico. Aborda as aplicações e as utilizações futuras. Ron, pode falar-nos um pouco sobre a história do índio

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Nano-Ag Sintering Paste

Phil Zarrow: This video is for anyone wondering about working with silver sintering materials. It will cover the roles of porosity and pressure. Dr. Lee, why work with silver sintering materials?

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Using Solder Preforms to Reduce Voiding in BTCs

Folks, Let's see how Patty and the team are doing on their presentation on voiding for Mike Madigan … Patty was kind of down. Like millions of others, she and Rob watched, in horror, as

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The 6 Alloy Families: Bismuth

Eric Bastow: Today we're going to be talking about this really unique metal called bismuth. One of the unique things about bismuth metal is, unlike other metals that contract when they solidify,

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The 6 Alloy Families: Gallium

Eric Bastow: Today we're going to be talking about this really cool metal called gallium. It's very unique, because it has a low melting point, and melts at 30 degrees C or 86 degrees

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The 6 Alloy Families: Gold

Eric Bastow: Gold is very useful as a soldering material when it's used with alloys. They have very high melting points, and, for that reason, sometimes the gold-based alloys are referred to as

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The 6 Alloy Families: Lead

Eric Bastow:Today, we're going to be talking about a heavy metal – not heavy metal the kind of music, but a heavy metal – lead. Lead has a very high melting point of 327 degrees

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The 6 Alloy Families: Tin

Eric Bastow: Tin is a very useful metal, very shiny metal, and it melts at 232 degrees C, which is 450 degrees Fahrenheit. It is very useful, because it has a long and wide history for use in

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As 6 famílias de ligas metálicas: Indium - Parte 2

Eric Bastow: O índio é um metal muito versátil. Liga-se facilmente com outras coisas como o bismuto, o estanho e o chumbo e isso dá-nos um grande espetro, uma vasta gama de pontos de fusão, com todos esses

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How to Properly Use Cp and Cpk in SMT Assembly

Phil Zarrow: This video is for those in the electronics assembly industry that want to establish when to properly use Cp and Cpk. It includes statistical data and examples. Dr. Lasky, an important

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Minimizing the Head-in-Pillow Defect in SMT Assembly

Phil Zarrow: This video is for those in the electronics assembly industry that want to minimize the head-in-pillow defect. It includes the solder paste properties that help overcome this challenge.

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Assessing Field Reliability and Defect Rates in Electronics Assembly

This is video is for electronics assemblers who are required to assess field reliability. It includes determining whether or not sampling can prove that there are zero defects. Phil Zarrow:

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SMT Wave Soldering: WaveCoach® Helps Optimize Profiling

This video is for electronics assembly professionals who are looking to improve their wave soldering processes. It includes tools and resources that will help overcome common challenges. Phil Zarrow:

Na Indium, investigamos, desenvolvemos e fabricamos soluções avançadas de materiais de montagem de eletrónica para os desafios de hoje, de amanhã e do futuro.