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Indium Corporation Expert to Present at ICEPT

Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China.

The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues like outgassing, voiding, and pump-out. In Versatile TIM Solution with Chain Network Solder Composite, Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.

Dr. Lee has been with Indium Corporation since 1986. He has more than three decades of experience in the development of fluxesalloys, and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.

A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina e gestão térmica. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a empresa tem apoio técnico global e fábricas localizadas na China, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.

Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.