Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will share his industry expertise during the 21st International Conference on Electronic Packaging Technology (ICEPT), Aug. 12-15 in Guangzhou, China.
The demand for faster, more powerful devices in the electronics industry makes thermal management a high priority as the need for improved high-performance materials continues to grow. While common thermal interface material (TIM) solutions like thermal grease, thermal gel, solder preforms, and liquid solder all have their own benefits, they can also be subject to common reliability issues like outgassing, voiding, and pump-out. In Versatile TIM Solution with Chain Network Solder Composite, Dr. Lee examines the development of a novel TIM solution with a high-melting Cu chain network that prevents these defects.
Dr. Lee has been with Indium Corporation since 1986. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Indium Corporation 是全球电子、半导体、薄膜和热管理市场的主要材料制造商和供应商。产品包括焊料和助焊剂；钎料；热界面材料；溅射靶材；铟、镓、锗、锡金属和无机化合物；以及 NanoFoil®。公司成立于 1934 年，拥有全球技术支持，在中国、印度、马来西亚、新加坡、韩国、英国和美国均设有工厂。
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