Indium Corporation’s Kenny Chiong, Senior Technical Support Engineer, will present Ultra-low Residue, No-Clean Material for Advanced Packaging Assembly at SEMICON Southeast Asia, on April 26-28 in Penang, Malaysia.
Chiong’s presentation will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the flip-chip, as well as in system-in-package (SiP) assembly processes. Ultra-low residue no-clean fluxes help to Avoid the Void™ by reducing the flux residue left behind after soldering, thereby decreasing the danger of delamination.
Chiong is based in Singapore and assists customers in the optimization of manufacturing processes, inclupding technical support for Indium Corporation’s full suite of products. Prior to joining Indium Corporation, Kenny provided technical support for surface mount technology processes, as well as equipment. Additionally, he also reviewed designs for printed circuit board assembly to maintain quality, delivery, and optimal output for manufacturing standards. Chiong holds a bachelor’s degree in mechanical and manufacturing engineering from the Universiti Malaysia Sarawak and has earned his Six Sigma Green Belt.
A Indium Corporation é um dos principais fabricantes e fornecedores de materiais para os mercados globais de eletrónica, semicondutores, película fina, gestão térmica e solar. Os produtos incluem soldas e fluxos; brasagens; materiais de interface térmica; alvos de pulverização; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e NanoFoil®. Fundada em 1934, a Indium tem apoio técnico global e fábricas localizadas na China, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.
Para mais informações sobre a Indium Corporation, visite www.indium.com ou envie um e-mail para [email protected]. Também pode seguir os nossos especialistas, From One Engineer To Another® (#FOETA), em www.facebook.com/indium ou @IndiumCorp.
