Indium Corporation’s Kenny Chiong, Senior Technical Support Engineer, will present Ultra-low Residue, No-Clean Material for Advanced Packaging Assembly at SEMICON Southeast Asia, on April 26-28 in Penang, Malaysia.
Chiong’s presentation will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the flip-chip, as well as in system-in-package (SiP) assembly processes. Ultra-low residue no-clean fluxes help to Avoid the Void™ by reducing the flux residue left behind after soldering, thereby decreasing the danger of delamination.
Chiong is based in Singapore and assists customers in the optimization of manufacturing processes, inclupding technical support for Indium Corporation’s full suite of products. Prior to joining Indium Corporation, Kenny provided technical support for surface mount technology processes, as well as equipment. Additionally, he also reviewed designs for printed circuit board assembly to maintain quality, delivery, and optimal output for manufacturing standards. Chiong holds a bachelor’s degree in mechanical and manufacturing engineering from the Universiti Malaysia Sarawak and has earned his Six Sigma Green Belt.
Indium Corporation 是全球電子、半導體、薄膜、熱管理和太陽能市場的主要材料製造商和供應商。產品包括焊錫和助熔劑、銅钎、熱介面材料、濺鍍靶材、铟、鎵、錫金屬和無機化合物，以及 NanoFoil®。Indium 成立於 1934 年，擁有全球性的技術支援，工廠分佈於中國、馬來西亞、新加坡、南韓、英國和美國。
如需更多關於 Indium Corporation 的資訊，請造訪www.indium.com或寄電子郵件至 [email protected]。您也可以透過www.facebook.com/indium或@IndiumCorp 追蹤我們的專家，From One Engineer ToAnother®(#FOETA)。
