Especialista da Indium Corporation irá apresentar a solução sTIMs para os desafios térmicos da IA na IEEE ECTC

CLINTON, N.Y., May 13, 2026 — Indium Corporation^® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.

The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder Thermal Interface Materials in Large Area BGA Packages, reveals that indium sTIMs, with 86W/mK thermal conductivity, significantly outperform polymer thermal interface materials (TIMs) through enhanced metallurgical bond capability, and improved thermal cycling performance and reliability. Additionally, vacuum formic acid reflow minimizes voiding—critical for multi-reflow applications like BGA assembly. Research results demonstrate pathways to ultra-low voiding for uniform heat dissipation in demanding next-generation processors and data center applications.

Kyle Aserian is an Applications Development Engineer in the ESM department, specializing in high-performance TIMs and their successful implementation into real-world assemblies. He joined Indium Corporation in 2022 as a Research Associate Scientist, focusing on solder alloy characterization and test method development.

ECTC attendees can attend Aserian’s presentation on May 27 at 11:55 a.m. EDT. To learn more about Indium Corporation’s solder thermal interface materials, visit indium.com or meet with our experts at ECTC booth 240.

Sobre a Indium Corporation

^A Indium^{Corporation®} é uma empresa líder na refinação, fundição, fabrico e fornecimento de materiais para os mercados globais de eletrónica, semicondutores, películas finas e gestão térmica. Os produtos incluem soldas e fluxos; ligas de brasagem; materiais de interface térmica; alvos de pulverização catódica; metais e compostos inorgânicos de índio, gálio, germânio e estanho; e^NanoFoil®. Fundada em 1934, a empresa dispõe de apoio técnico global e fábricas localizadas na China, Alemanha, Índia, Malásia, Singapura, Coreia do Sul, Reino Unido e EUA.

For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/.